Convective Cooling Enhancement in Electronic Systems by Using Vibration

Electronics and heat have been linked due to the high demand. Every heat sink
generates a specific temperature which yields to the generation of a thermal boundary
layer profile that when disturbed; would allow for higher rates of heat dissipation. Inorder,
to make this project feasible, a specific electronic device had to be selected and,
in this case, it is a computer. Computers are the focus of this era since it can perform
a higher level of data processing than a laptop. The selected computer model is Intel
Xeon E5-2650 v3 2.3GHz which commonly used in the university. The heat sink’s
(processor) area has been enlarged by the addition fins onto it, there is enough space
inside the computer to allow for this. The purpose of the numerical simulation is to
investigate the ideology of heat dissipation when the surface area is enlarged and since
computers vibrate due to the cooling fan, that vibration is going to be induced to the
enlarged heat sink as part of the simulation. Consequently, the enhancement that has
occurred for both cases of the processor before and after the enlargement of the area
are going to be compared and studied with the vibration induced at different
amplitudes. Moreover, varying the amplitude of vibration to evaluate with would yield
to enhanced heat dissipation is the main objective of this investigation. Finally,
vibration has proved to enhance the heat transfer further than with only the surface
area enlarged.