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Design and Thermal Simulation of a Lead-Free Electronic Circuit Package

Aminnordin Bin Mat, Aminnordin (2008) Design and Thermal Simulation of a Lead-Free Electronic Circuit Package. Other thesis, Universiti Teknologi Petronas.

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Abstract

This project is about thermal analysis of a lead free electronic package by running a thermal simulation using ANSYS software. The electronic package can be damaged if it is operated at temperatures that exceed its limit. The main objective of this project is to determine the heat dissipation rate and maximum temperature of an electronic package in its working condition.

Item Type: Thesis (Other)
Subject: T Technology > TJ Mechanical engineering and machinery
Divisions: ?? sch_eng ??
Depositing User: Users 5 not found.
Date Deposited: 11 Jan 2012 12:18
Last Modified: 19 Jan 2017 15:49
URI: http://utpedia.utp.edu.my/id/eprint/273

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