Thermal Analysis of Semiconductor: Peak Junction Temperature Prediction

Hussin, Nur Ain Nabilah (2016) Thermal Analysis of Semiconductor: Peak Junction Temperature Prediction. [Final Year Project] (Submitted)

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Semiconductor industries become really important towards today’s technology.
Integrated Circuit (IC) are produced to meet the demand since there are lots of modern
devices nowadays rely on this semiconductor devices. Due to this scenario, most ICs are
designed to operate with high power dissipation and speed together with greater
packaging density. This features will lead to the increasing of operating temperature as
well as decrease the reliability and performance of the system. Besides, the performance
of the devices also might be degrade or even fail to function properly. Therefore to
overcome this problem, thermal analysis need to be carried out in order to determine the
thermal profile of the system and to predict the peak junction temperature. So that, an
appropriate cooling strategy and temperature monitoring system can be implemented to
provide a controlled temperature surface to an electronic component.

Item Type: Final Year Project
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Departments / MOR / COE: Engineering > Electrical and Electronic
Depositing User: Mr Ahmad Suhairi Mohamed Lazim
Date Deposited: 17 Feb 2022 02:52
Last Modified: 17 Feb 2022 02:52

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