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The Effect Of Pre-Tinning Process With Respect To Gold Embrittlement Issue For Gold Plated Pins

Mohammad Noor Bin Md Yassin, Mohammad Noor (2010) The Effect Of Pre-Tinning Process With Respect To Gold Embrittlement Issue For Gold Plated Pins. Universiti Teknologi Petronas. (Unpublished)

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This project is a study of interaction between tin-lead solder with gold that associated with intermetallic compound IMC. Alloy Sn63Pb37 solder is used as a control for the experiment. Effect of IMC formation to joint reliability is studied by varying the gold thickness through pre-tinning process. A rough guide of implementation to prevent gold embrittlement to Sn63Pb37 solder is given at the end of the research. Physical analysis equipment X-ray fluorescence (XRF) and high power optical scope for IMC microstructure investigation are utilized. It is found out in this study that the time of pre-tinning process where the pins are submerge into solder bath contribute to the magnitude of IMC formation.

Item Type: Final Year Project
Subject: T Technology > TJ Mechanical engineering and machinery
Divisions: Engineering > Mechanical
Depositing User: Users 5 not found.
Date Deposited: 11 Jan 2012 12:23
Last Modified: 25 Jan 2017 09:43
URI: http://utpedia.utp.edu.my/id/eprint/1488

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