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Thermal Analysis of VLSI System: A Simulation Study

Nik Ab Rashid, Nik Nur Nailini (2016) Thermal Analysis of VLSI System: A Simulation Study. IRC, Universiti Teknologi PETRONAS. (Submitted)

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Smaller size of Very Large Scale Integrated (VLSI) System nowadays increases the on chip power densities causing the rise of temperature in the system. The high temperature produced will eventually affects the clock frequency of the system and changes the timing setup of the component. These lead to lowering the performance and reliability of the system. Due to the negative effects of the high temperature, designers have to determine the thermal profile of the systems in order to understand the temperature distribution, the leakage reduction and estimate the power distribution of the system. This research focuses on analyzing the thermal profile of a VLSI system under steady state condition using numerical techniques and simulation. For the numerical techniques, the governing heat equation for a two-dimensional (2D) model was solved using Finite Difference Method (FDM), Gauss-Seidel (GS) and Successive Over Relaxation (SOR) methods. Simulation based on ANSYS simulator has been conducted for validation purpose. Most commonly material used in VLSI system which is Silicon (Si) is tested under adiabatic condition. The results for numerical techniques and the simulation are compared. SOR method shows better results in terms of number of iterations and the computational time compared to GS method in solving the governing heat equation. Both methods have the same maximum temperature and these temperatures are comparable with the result obtained by using ANSYS.

Item Type: Final Year Project
Academic Subject : Academic Department - Electrical And Electronics - Pervasisve Systems - Digital Electronics - Design
Subject: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions: Engineering > Electrical and Electronic
Depositing User: Ahmad Suhairi Mohamed Lazim
Date Deposited: 19 Jan 2017 15:38
Last Modified: 25 Jan 2017 09:34
URI: http://utpedia.utp.edu.my/id/eprint/17081

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