Welcome To UTPedia

We would like to introduce you, the new knowledge repository product called UTPedia. The UTP Electronic and Digital Intellectual Asset. It stores digitized version of thesis, dissertation, final year project reports and past year examination questions.

Browse content of UTPedia using Year, Subject, Department and Author and Search for required document using Searching facilities included in UTPedia. UTPedia with full text are accessible for all registered users, whereas only the physical information and metadata can be retrieved by public users. UTPedia collaborating and connecting peoples with university’s intellectual works from anywhere.

Disclaimer - Universiti Teknologi PETRONAS shall not be liable for any loss or damage caused by the usage of any information obtained from this web site.Best viewed using Mozilla Firefox 3 or IE 7 with resolution 1024 x 768.

Signal Integrity Analysis for High Speed Digital Circuit

Shang, Erica Ting Mei (2009) Signal Integrity Analysis for High Speed Digital Circuit. UNSPECIFIED. (Unpublished)

[img]
Preview
PDF
Download (13Mb) | Preview

Abstract

This dissertation report marks the commencement of the Final Year Project (FYP) titled Signal Integrity Analysis for High Speed Digital Circuit. This project is a study on various signal integrity (SI) issues that could possibly come into play on Printed Circuit Boards (PCBs). This project is conducted to analyze and grasp a better understanding on the nature of the problem, how the problem is manifested in circuits and what design solutions can be employed to minimize its effects. Such a study is not something new but is definitely getting more crucial as the vast improvement in chip fabrication technology leads to logic families operating at a much higher speed, resulting to a faster rise time which will worsen the noise phenomena, i. e. reflection, crosstalk, and power system stability during component switching. Several causes to signal integrity issues on the printed circuit boards are analyzed and both proper and improper circuit design techniques are implemented on the Advanced Design System (ADS) software for data collection and analysis. Deliverables at the end this project would be the simulation results to support the study, whereby several simulations are conducted to demonstrate and verify the theoretical study of signal integrity issues. Besides that, the designs will then be fabricated on a two-layer microstrip board and tested on the Digital Communication Analyzer (DCA) to obtain more practical results. A project Gantt chart is attached in the appendix to illustrate the work flow and anticipated progress.

Item Type: Final Year Project
Subject: UNSPECIFIED
Divisions: Engineering > Electrical and Electronic
Depositing User: Users 5 not found.
Date Deposited: 18 Jun 2012 09:52
Last Modified: 25 Jan 2017 09:44
URI: http://utpedia.utp.edu.my/id/eprint/3262

Actions (login required)

View Item View Item

Document Downloads

More statistics for this item...