UTPediaMohammad Noor Bin Md Yassin, Mohammad Noor (2010) The Effect Of Pre-Tinning Process With Respect To Gold Embrittlement Issue For Gold Plated Pins. [Final Year Project] (Unpublished)
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Abstract
This project is a study of interaction between tin-lead solder with gold that associated with intermetallic compound IMC. Alloy Sn63Pb37 solder is used as a control for the experiment. Effect of IMC formation to joint reliability is studied by varying the gold thickness through pre-tinning process. A rough guide of implementation to prevent gold embrittlement to Sn63Pb37 solder is given at the end of the research. Physical analysis equipment X-ray fluorescence (XRF) and high power optical scope for IMC microstructure investigation are utilized. It is found out in this study that the time of pre-tinning process where the pins are submerge into solder bath contribute to the magnitude of IMC formation.
| Item Type: | Final Year Project |
|---|---|
| Subjects: | T Technology > TJ Mechanical engineering and machinery |
| Departments / MOR / COE: | Engineering > Mechanical |
| Depositing User: | Users 5 not found. |
| Date Deposited: | 11 Jan 2012 12:23 |
| Last Modified: | 25 Jan 2017 09:43 |
| URI: | http://utpedia.utp.edu.my/id/eprint/1488 |
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