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Uniformity of Plating Thickness of IC Packages at Various Locations on its Lead Frame

Farah Liyana Binti Ab. Ghani, Farah Liyana (2010) Uniformity of Plating Thickness of IC Packages at Various Locations on its Lead Frame. Universiti Teknologi Petronas. (Unpublished)

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Abstract

This report outlines a project entitled ‘Uniformity of Plating Thickness of IC Packages at Various Locations on its Lead Frame’. The project is conducted with the collaboration of IDS Electronics Sdn Bhd, a company that offers semi conductor assemblies and services. IC package used in this study is SOT-23-3L EIAJ matrix lead frame with tin plating since it is the most critical product in IDS Electronics that frequently having problem during its plating process. Hence, this project aims to measure plating thickness at various locations on its tin plated lead frame and simultaneously acts as continuous quality improvement (CQI) for this particular package. Metallographic technique has been employed entirely throughout this study in order to measure the plating thickness of IC lead frame. The result from this study shows that the average tin plating thickness of SOT-23-3L EIAJ IC package lead frame is 14.976 μm and its standard deviation of 2.458 μm. Plating thickness measured from this random condition plating solution show some variations of thickness but no measurements were found to lie outside the thickness specification range of 7μm to 20μm [Joseph Gauci, 2002]. Variations in surface finish were also apparent depending on location of the lead frame. Outputs of this study may ensure the company to produce better product with high quality on top of plating process can be performed with more practical and cost saving in the future production.

Item Type: Final Year Project
Subject: T Technology > TJ Mechanical engineering and machinery
Divisions: Engineering > Mechanical
Depositing User: Users 5 not found.
Date Deposited: 11 Jan 2012 12:23
Last Modified: 25 Jan 2017 09:43
URI: http://utpedia.utp.edu.my/id/eprint/1460

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