Implementation of Arithmetic Mean Method on Determination of Peak Junction Temperature of Semiconductor Device on Printed Circuit Board

High reliability users of microelectronic devices have been derating junction temperature and other critical stress parameters to improve device reliability and extend operating life. The junction temperature is what really matters for component functionality and reliability. This study presents a useful analysis on mathematical approach which can be implemented to predict thermal behavior in Integrated Circuit (IC). The problem could be modeled as heat conduction equation. In this study, numerical approaches based on implicit scheme and Arithmetic Mean (AM) iterative method will be applied to solve the governing heat conduction equation. From the numerical results obtained, it shows that AM method solves the governing heat conduction equation with minimum number of iterations and fastest computational time compared to the Gauss-Seidel (GS) method. It is in design phase when simulations and modeling are carried out to ensure high performance and reliability. The availability of thermal analysis tool for maximum temperature prediction would be of great value to designers of power device ICs.