CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components.

Mohd Hanif, Muhammad Zharif Mifdhal (2024) CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components. [Final Year Project] (Submitted)

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Item Type:	Final Year Project
Subjects:	T Technology > TJ Mechanical engineering and machinery
Departments / MOR / COE:	Engineering > Mechanical
Depositing User:	Mr Ahmad Suhairi Mohamed Lazim
Date Deposited:	19 Aug 2024 02:25
Last Modified:	19 Aug 2024 02:25
URI:	http://utpedia.utp.edu.my/id/eprint/28822

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