CFD modelling of heat sinks thermal boundary layer effect on cooling of electronic components.

This research provides a thorough analysis of the function of thermal boundary layers in the electronic component cooling process, emphasising the significance of heat sink application and design. We explore the performance of various heat sink topologies under varied thermal boundary conditions using the capabilities of Computational Fluid Dynamics (CFD) modelling. The key objective performs numerical computer investigation by modelling heat sink design with different fin in order to breaking the thermal boundary layer and increase Nusselt number and to investigate different of heat sink design including inline, stagger and further stagger configuration and compare with objective 1 to determine which configuration best to improve Nusselt number. This study gives a complete simulation of the heat sink under various conditions based on a rigorous exploration of fluid dynamics and heat transfer principles. The methodology used to conduct research to breaking the thermal boundary by using different configuration will be covered in the methodology part. Finally, there is a conclusion that discusses the relevance of the aims and recommendations for the propose work.