New Design of Heat Spreader for Semiconductor Device

The objective of this project is to improve the heat removal efficiency of heat spreader by replacing the currently used material with copper-carbon composite. Thermal conductivity and coefficient of thermal expansion are parameters that must be considered to select a good material for heat spreader. Copper which is currently used as heat spreader has an excellent thermal conductivity but poor coefficient of thermal expansion. In this project, the effect on thermal conductivity and coefficient of thermal expansion is investigated by adding carbon to copper. Three samples are prepared by using Hand Press machine and the test for thermal conductivity is conducted by using Hilton Heat Conduction unit. Analysis after experiment shows that sample 1 come out with better value for both parameters compare to copper and alumimium. Results suggest that adding carbon to copper would decrease the thermal conductivity but yield better coefficient of thermal expansion.