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Defect Study ofPCBA at Manufacturing Company

Harun, Habibah (2011) Defect Study ofPCBA at Manufacturing Company. Universiti Teknologi Petronas. (Unpublished)

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Abstract

This report basically presents the research that had been done so far based on this chosen topic, which is Defect Study ofPCBA at Manufacturing Company. A study of the defect has been undertaken as part of the design aod construction of a Knowledge-based System (KBS). The KBS will be required to contribute to a quality improvement in the maoufacture of Printed Circuit Board Assemblies (PCBA) aod in particular the defect level of the soldering process at maoufacturing facility. The defects that often occur during maoufacturing the PCBA is solder bridging. The project has involved the formal study of solder bridging during the maoufacture of highly complex aod sophisticated PCBA. The study methods used have included academic research, carefully designed experiments by Celestica engineers, observations of the maoufacturing processes aod interviews with a wide raoge of Celestica personnel. A process model has been developed to adopt a high level approach to the problem area aod as such embodies the ultimate goals of the proposed system. During the course of the project so far, in addition to the system process model development, part of the PCBA KBS has also been initiated.

Item Type: Final Year Project
Academic Subject : Academic Department - Mechanical Engineering - Manufacturing - Fabrication, forming and shaping - Rapid manufacturing
Subject: T Technology > TJ Mechanical engineering and machinery
Divisions: Engineering > Mechanical
Depositing User: Users 2053 not found.
Date Deposited: 30 Sep 2013 16:25
Last Modified: 25 Jan 2017 09:42
URI: http://utpedia.utp.edu.my/id/eprint/7180

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