Defect Study ofPCBA at Manufacturing Company

This report basically presents the research that had been done so far based on this
chosen topic, which is Defect Study ofPCBA at Manufacturing Company. A study of the
defect has been undertaken as part of the design aod construction of a Knowledge-based
System (KBS). The KBS will be required to contribute to a quality improvement in the
maoufacture of Printed Circuit Board Assemblies (PCBA) aod in particular the defect level of
the soldering process at maoufacturing facility. The defects that often occur during
maoufacturing the PCBA is solder bridging. The project has involved the formal study of
solder bridging during the maoufacture of highly complex aod sophisticated PCBA. The
study methods used have included academic research, carefully designed experiments by
Celestica engineers, observations of the maoufacturing processes aod interviews with a wide
raoge of Celestica personnel. A process model has been developed to adopt a high level
approach to the problem area aod as such embodies the ultimate goals of the proposed
system. During the course of the project so far, in addition to the system process model
development, part of the PCBA KBS has also been initiated.